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MAP2009
The 9th International Workshop on Microelectronics Assembling
and Packaging （MAP2009：マップ2009） |
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Wednesday 11th, November |
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【Opening Remark 13:00 - 13:05】 |
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Hajime Tomokage
Fukuoka University (JAPAN) |
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【Session 1: Invited Talks 13:05 - 15:00】 |
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Chair: Todd Takaki
Inoueki., Ltd. (SINGAPORE) |
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13:05 - 13:45 |
1-1 Present and Future of Digital Technology
Junshi Yamaguchi
NEC Electronics Corporation (JAPAN) |
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13:45 - 14:00 |
1-2 Electronics Industry in India-an Overview
N Krishnan
Software Technology Parks of India (INDIA) |
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14:00 - 14:30 |
1-3 Overview of the Indian Automotive Industry: The growth of Mahindra Group
Vishal Pawar
Mahindra Engineering Services Ltd. (INDIA) |
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14:30 - 15:00 |
1-4 Current and Future Strategy of Semiconductor Industry in the U.S.A.
Joseph Fjelstad
Verdant Electronics and Silicon Pipe (U.S.A.) |
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15:00 - 15:30 |
Coffee Break |
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15:30 - 15:50 |
Signing Ceremony of Memorandum of Understanding between
ASTSA & MEPTEC |
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15:50 - 16:00 |
Coffee Break |
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【Session 2:Green Device 16:00 - 17:40】 |
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Chair: Masahiro Kashiwagi
Kumamoto Industrial Research Institute (JAPAN) |
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16:00 - 16:15 |
2-1 Recent Technology of Organic Electro-Luminescence(OEL)
Kiyoshi Yoneda
FPD Technology Consultant (JAPAN) |
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16:15 - 16:30 |
2-2 CMOS Camera Module Technology Trend for Mobile Application
Tomoaki Iizuka
Toshiba Corporation, Semiconductor Company (JAPAN) |
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16:30 - 16:45 |
2-3 Colorful and Plastic Solar Cells for Ubiquitous Power Generation
Tsukasa Yoshida
Gifu University (JAPAN) |
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16:45 - 17:00 |
2-4 Our Latest Model FS3500N – Short Cycle Time of 1.7 sec/chip is Attainable in Combination with High Alignment Accuracy of ±2μm, by Our Original Function and Highly Stiff frame Structure.
Fuhito Shinji
Toray Engineering Co.,Ltd. (JAPAN) |
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17:00 - 17:15 |
2-5 Laser Scribing of Hard and Brittle Materials (Sapphire, GaN, SiC)
Shohei Nagatomo
Laser Solutions Co., Ltd. (JAPAN) |
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17:15 - 17:40 |
Coffee Break |
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【Session 3:3D Integration -Part 1- 17:40 - 18:20】
(Knowledge Cluster Initiative (The 2nd Stage) Expansion Program, The 4th Workshop) |
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Chair: Yoshio Nogami
Toray Engineering Co., Ltd. (JAPAN) |
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17:40 - 18:00 |
3-1 Standardization of Device Embedded (Both Active and Passive) Electronic Circuit Board Technology
Akikazu Shibata
Japan Electronics Packaging and Circuits Association (JPCA) (JAPAN) |
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18:00 - 18:20 |
3-2 Application and production scenario of TSV-3D Technology
Hirohisa Matsuki
Fujitsu Microelectronics Limited (JAPAN)
Japan Electronics and Information Technology Industries Association (JEITA) (JAPAN) |
【Reception Party @TINGA TINGA 18:30 -20:00】 |
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Thursday 12th, November |
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【Session 4: Power Electronics 09:00 - 09:55】 |
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Chair: Daisuke Yamaguchi
ALDETE Corporation (JAPAN) |
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09:00 - 09:20 |
4-1 Technologies and Trends Related to Intelligent Power Module (IPM)
Gourab Majumdar
Mitsubishi Electric Corporation (JAPAN) |
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09:20 - 09:40 |
4-2 Bridges from Chips to Packages
Tadaharu Minato
Mitsubishi Electric Corporation (JAPAN) |
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09:40 - 09:55 |
4-3 Electric Vehicle – The New Revolution
Hemalatha Annamalai
Ampere Vehicles Pte Ltd (INDIA) |
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09:55 - 10:20 |
Coffee Break |
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【Session 5: 3D Integration -Part2- 10:20 - 12:30】
(Knowledge Cluster Initiative (The 2nd Stage) Expansion Program, The 4th Workshop) |
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Chair: Hisao Kasuga
NEC Electronics Corporation (JAPAN)
Japan Electronics and Information Technology Industries Association (JEITA) (JAPAN) |
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10:20 - 10:35 |
5-1 RENESAS SiP Future 3D Technology
Masashi Umino
Renesas Technology Corp. (JAPAN) |
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10:35 - 10:50 |
5-2 EDA tools for Analog/Mixed-Signal IC and MEMS Layout Design for Circuit Design, Layout Design and Layout Verification
Yoshiko Shimogaki
Tanner Research Japan K.K. (JAPAN) |
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10:50 - 11:05 |
5-3 Report on Active Device Embedding Technology using ESC5 Process
S.Sasaguri, H.Eifuku, H.Maruo, K.Motomura, T.Sakai
Panasonic Factory Solutions Co., Ltd. (JAPAN) |
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11:05 - 11:20 |
5-4 Electrical Modeling of Power Device Package with Q3D Extractor
Toru Watanabe
Ansoft Japan K.K |
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11:20 - 11:30 |
Short Break |
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11:30 - 11:45 |
5-5 Electrochemical process for through via/bump formation without CMP and Lithographic
Processes
Jae-Ho Lee
Hongik University (KOREA) |
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11:45 - 12:00 |
5-6 SUSS MicroTec in 3D Integration
Raymond Lau
SUSS MicroTec Japan (JAPAN) |
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12:00 - 12:15 |
5-7 Sidewall Insulator Film Deposition for the Through Silicon Via (TSV) Process Using Cathode Coupled PE-CVD
Y. Kusuda, T. Minaguchi, T. Miyashita and S. Motoyama
SAMCO, Inc. (JAPAN) |
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12:15 - 12:30 |
5-8 Impact of the rf-Glow Discharge Technology on Surface and Cross-Section Analyses
Toru Kaga* and Kenny Iwasaki**
Nanoscale Company (JAPAN) |
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12:30 - 13:30 |
Lunch Break |
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【Session 6: Taiwan Session 13:30 - 15:00】
(Knowledge Cluster Initiative (The 2nd Stage) Expansion Program, The 4th Workshop)
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Chair: Akihiro Kawaguchi
Fukuoka Industry, Science & Technology Foundation (JAPAN) |
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13:30 - 14:00 |
6-1 Taiwan 3DIC Value Chain: The Next Revolution for Taiwan Semiconductor Industries
Ian Yi-Jen Chan
Electronics and Optoelectronics Research Lab., Industrial Technology Research Institute (ITRI) (TAIWAN) |
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14:00 - 14:20 |
6-2 Semiconductor Business in Taiwan
Yoshinori Sasaki
MARUBUN TAIWAN, INC. (TAIWAN) |
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14:20 - 14:40 |
6-3 High Speed DRAM Package Bandwidth Simulation
Fan, Wen-Jeng
Powertech Technology Inc. (PTI) (TAIWAN) |
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14:40 - 15:00 |
6-4 SoC Design and Turnkey Services in Taiwan
James Cheng
Global Unichip Corporation (GUC) (TAIWAN) |
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15:00 - 15:30 |
Coffee Break |
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【Session 7: India Session 15:30 - 17:10】 |
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Chair: Hajime Tomokage
Fukuoka University (JAPAN) |
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15:30 - 15:50 |
7-1 India: The Rising Player in The World Electronics Design Stage
Poornima Shenoy
India Semiconductor Association (ISA) (INDIA) |
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15:50 - 16:10 |
7-2 India Semiconductor Vision ISV 2020
Pradip K. Dutta
Synopsys (I) Pvt Ltd. (INDIA) |
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16:10 - 16:30 |
7-3 Automotive Systems- Semiconductor Perspectives: Analog Function Realization- Challenges and Potential
R. Ramabrahmam
KPIT Cummins Infosystems Ltd. (INDIA) |
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16:30 - 16:50 |
7-4 Exploring Business Opportunities for Kyushu in Collaboration with Indian Partners
Tetsuya Tsuruta
PATNI Computer Systems Ltd. (INDIA) |
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16:50 - 17:10 |
7-5 “eInfochips” – Your Strategic Partner for your Electronics Design, Development and Verifications
Satoshi Yamada
eInfochips. Ltd. (INDIA) |
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【Session 8: Poster Session with Wines @Argos 17:30 ~ 19:00】 |
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Chair: KS Dorai Arasu
InfoSree Technologies Pvt. Ltd. (INDIA) |
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Friday 13th, November |
| Excursion Schedule |
| 07:30 |
JAL Resort Sea Hawk Hotel Fukuoka, 1F Robby |
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10:00 - 12:00 |
Tokyo Electron Kyushu Limited, Head Office, Goshi Plant |
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12:00 - 13:00 |
Lunch |
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13:30 - 15:30 |
Mitsubishi Electric Corporation, Power Device Works, Kumamoto Plant |
| 17:30 |
Fukuoka Airport, Hakata Station |
